SERVICE MANUAL
Ver 1.0 1998. 06
MDR-RF930 is headphones
in MDR-RF930K.
MICROFILM
MDR-RF930
SPECIFICATIONS
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
WIRELESS STEREO HEADPHONES
US Model
Canadian Model
Table of Contents
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Summary of Contents for Sony MDR-RF930

  • Page 1 MDR-RF930 SERVICE MANUAL US Model Canadian Model Ver 1.0 1998. 06 MDR-RF930 is headphones in MDR-RF930K. SPECIFICATIONS Notes on chip component replacement • Never reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be dam- aged by heat.
  • Page 2: Section 1 General

    SECTION 1 This section is extracted from instruction manual. GENERAL – 2 –...
  • Page 3: Section 2 Disassembly

    SECTION 2 DISASSEMBLY • This set can be disassembled in the order shown below. HOUSING (R) ASSY, HANGER (R) RX BOARD HOUSING (L) ASSY, HANGER (L) BATTERY CASE Note: Follow the disassembly procedure in the numerical order given. HOUSING (R) ASSY, HANGER (R) 5 hanger (R) 4 two screws (P2 ×...
  • Page 4 RX BOARD 6 two head bands 4 push (1 key) SWITCH 2 two screws (B1.7 × 4) 1 RX board 7 suspender assy 3 RX shield plate 5 tension spring BATTERY CASE 4 two head bands 5 suspender assy 1 two screws (P2 ×...
  • Page 5: Section 3 Electrical Adjustments

    3. Enter 1 kHz 316 mVrms signal only to the Lch on the transmitter. 4. Place the transmitter away from the headphone (MDR-RF930) more than 5 m. 5. Set the volume control (RV301) on the RX-BASE board to the minimum position.
  • Page 6 3-2. Degree of Modulation of Main Carrier (L + R) Check and Adjustment Preparation: AF OSC TMR-RF930 MDR-RF930 Trans- Head- – – – mitter phones 600 Ω AUDIO IN (Lch) 1 kHz 316 mVrms [RX-BASE board] – Conductor Side –...
  • Page 7 3-3. Separation Check and Adjustment Preparation: AF OSC TMR-RF930 MDR-RF930 Trans- Head- – – – mitter phones 600 Ω AUDIO IN (Lch or Rch) 1 kHz 316 mVrms AC voltmeter oscilloscope – [RX-BASE board] – Conductor Side – Procedure: 1. Set the channel of the transmitter to CH2.
  • Page 8 Adjustment Location: Transmitter (TMR-RF930) [TX-BASE board] – Component Side – RV404 Degree of Modulation of Main Carrier (L + R) Adjustment J403 J402 (Lch) (Rch) – 8 –...
  • Page 9 Headphone (MDR-RF930) [RX-BASE board] – Conductor Side – [RX-BASE board] – Component Side – RV302 TUNING IC301 RV301 RV303 L301 Separation Adjustment Receiving Frequency Adjustment – 9 –...
  • Page 10: Section 4 Diagrams

    SECTION 4 DIAGRAMS • IC Block Diagrams IC301 CXA1611N-T4 IC302 LA4533M POWER 10 MUTE MUTE SWITCH R-OUT R-IN BIAS L-IN L-OUT – 10 –...
  • Page 11: Section 5 Exploded View

    SECTION 5 EXPLODED VIEW NOTE: • -XX and -X mean standardized parts, so they • Items marked “*” are not stocked since they may have some difference from the original are seldom required for routine service. Some one. delay should be anticipated when ordering •...
  • Page 12: Electrical Parts List

    SECTION 6 RX-BASE ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the • Items marked “*” are not stocked since they When indicating parts by reference number, please include the board. are seldom required for routine service. parts list may be different from the parts speci- fied in the diagrams or the components used Some delay should be anticipated when order- on the set.
  • Page 13 RX-BASE Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C316 1-163-023-00 CERAMIC CHIP 0.015uF JR316 1-216-296-00 SHORT C317 1-163-021-00 CERAMIC CHIP 0.01uF C318 1-164-346-11 CERAMIC CHIP < COIL > C319 1-164-505-11 CERAMIC CHIP 2.2uF L301 1-416-796-11 COIL, AIR-CORE C320 1-164-346-11 CERAMIC CHIP L302...
  • Page 14 MDR-RF930 RX-BASE Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < VARIABLE RESISTOR > RV301 1-223-968-11 RES, VAR, CARBON 20K/20K (VOL) RV302 1-225-641-11 RES, VAR, CARBON 10K (TUNING) RV303 1-238-857-11 RES, ADJ, CERMET 22K ************************************************************ MISCELLANEOUS...

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