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Huawei MU709s-2 Hardware Manual

Hspa+ lga module
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HUAWEI MU709s-2 HSPA+ LGA Module
Hardware Guide
Issue
03
Date
2014-09-18
Table of Contents
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Summary of Contents for Huawei MU709s-2

  • Page 1 HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide Issue Date 2014-09-18...
  • Page 2 Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.

  • Page 3: Revision History

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version 2014-07-16 Creation 2014-09-11 Deleted the Description of RESIN_N pin 3.4.3 Updated section 3.4.3: Reset the Module 2014-09-18 3.4.3 Updated section 3.4.3: Reset the Module...

  • Page 4: Table Of Contents

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide Contents Contents 1 Introduction............................ 7 2 Overall Description ........................8 2.1 About This Chapter ........................... 8 2.2 Function Overview..........................8 2.3 Circuit Block Diagram ........................9 2.4 Application Block Diagram ......................10 3 Description of the Application Interfaces ................12 3.1 About This Chapter .........................
  • Page 5 HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide Contents 3.12 Reserved Interface ........................42 3.13 NC Interface ..........................43 4 RF Specifications ......................... 44 4.1 About This Chapter ......................... 44 4.2 Operating Frequencies ........................44 4.3 Conducted RF Measurement ......................45 4.3.1 Test Environment ........................
  • Page 6 HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide Contents 6.9.1 Process of Rework ........................ 66 6.9.2 Preparations of Rework ......................67 6.9.3 Removing of the Module......................67 6.9.4 Welding Area Treatment ......................67 6.9.5 Module Installation ......................... 68 6.9.6 Specifications of Rework ....................... 68 7 Certifications ..........................

  • Page 7: Introduction

    This document describes the hardware application interfaces and air interfaces provided by MU709s-2 module. This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the MU709s-2 module. Huawei Proprietary and Confidential Issue 03 (2014-09-18)

  • Page 8: Overall Description

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 1BOverall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the MU709s-2 module and provides:  Function Overview  Circuit Block Diagram  Application Block Diagram 2.2 Function Overview...

  • Page 9: Circuit Block Diagram

    WCDMA PS: UL 384 kbit/s; DL 384 kbit/s HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s [1]: When the MU709s-2 module works outside of the range from –40°C to +85°C, NOT all its RF performances comply with 3GPP specifications. 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the MU709s-2 module.

  • Page 10: Application Block Diagram

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 1BOverall Description Figure 2-1 Circuit block diagram of the MU709s-2 module Nand flash HI6758M RFIC Hi6361 and Front end circuits LGA Interface 2.4 Application Block Diagram Figure 2-2 Application block diagram of the MU709s-2 module...
  • Page 11 HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 1BOverall Description UART Interface: The module supports 2 UART interfaces. One is 8-wire UART, and the other is 2-wire UART (only for debugging). USB Interface: The USB interface supports USB 2.0 high speed standard.

  • Page 12: Description Of The Application Interfaces

    Reserved Interface  NC Interface 3.2 LGA Interface The MU709s-2 module uses a 145-pin LGA as its external interface. For details about the module and dimensions, see 6.4 Dimensions and Interfaces . Huawei Proprietary and Confidential Issue 03 (2014-09-18) Copyright © Huawei Technologies Co., Ltd.
  • Page 13 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the MU709s-2 module. Figure 3-1 Sequence of LGA interface (Top view) Table 3-1 shows the definitions of pins on the 145-pin signal interface of the MU709s-2 module.
  • Page 14 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Table 3-1 Definitions of pins on the LGA interface Min.( Typ. Max. Description Parameter Comments Name Type UART1_ UART1 transmit 1.35 1.80 2.10 output for debugging. 0.45 Not connected, please keep this pin open.
  • Page 15 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Min.( Typ. Max. Description Parameter Comments Name Type VBAT Power supply input. 3.30 3.80 4.20 The rising time of VBAT must > 100 us VBAT Power supply input 3.30...
  • Page 16 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Min.( Typ. Max. Description Parameter Comments Name Type Not connected, please keep this pin open. Not connected, please keep this pin open. Not connected, please keep this pin open.
  • Page 17 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Min.( Typ. Max. Description Parameter Comments Name Type Not connected, please keep this pin open. JTAG_T JTAG clock input 1.26 1.80 2.10 –0.30 0.63 Reserved Reserved Reserved Reserved...
  • Page 18 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Min.( Typ. Max. Description Parameter Comments Name Type Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved SD_DAT SD Card data signal. 2.25 3.00 3.30 Only used for 0.75...
  • Page 19 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Min.( Typ. Max. Description Parameter Comments Name Type UART0_ UART0 data carrier 1.35 1.80 2.10 detect 0.45 UART0_ UART0 transmit 1.35 1.80 2.10 output 0.45 UART0_ UART0 ring indicator 1.35...
  • Page 20 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Min.( Typ. Max. Description Parameter Comments Name Type 0.2x USIM_D USIM card data 0.7 x 3.30 USIM_VC USIM C=1.80 V _VCC or 3.0 V 0.2 x 0.65x 3.30...
  • Page 21 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Min.( Typ. Max. Description Parameter Comments Name Type Not connected, please keep this pin open. Not connected, please keep this pin open. Not connected, please keep this pin open.
  • Page 22 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Min.( Typ. Max. Description Parameter Comments Name Type Ground General I/O pins. The GPIO3 1.35 1.80 2.10 function of these pins 0.45 has not been defined. 1.26 1.80 2.10...

  • Page 23: Power Interface

    Please contact with us for more details about this information. 3.3 Power Interface 3.3.1 Overview The power supply part of the MU709s-2 module contains:  VBAT pins for the power supply  VCC_EXT1 pin for external power output with 1.8 V ...

  • Page 24: Power Supply Vbat Interface

    When the MU709s-2 module is used for different external applications, pay special attention to the design for the power supply. When the MU709s-2 module works at 2G mode and transmits signals at the maximum power, the transient current may reach the transient peak value of about 2.75 A due to the differences in actual network...

  • Page 25: Output Power Supply Interface

    10 mA (typical value) for external level conversion or other applications. If the MU709s-2 module is in sleep mode, the output power supply interface is in the low power consumption state (< 500 μA). If the MU709s-2 module is in power down mode, the output power supply is in the disabled state.

  • Page 26: Power-On/Off (Power_On_Off) Pin

    L: Module is in sleep state LED_MODE Mode indicator Current sink Drive strength: 10 mA 3.4.2 Power-on/off (POWER_ON_OFF) Pin The MU709s-2 module can be controlled to power on/off by the POWER_ON_OFF pin. Table 3-4 Two states of POWER_ON_OFF Item. Pin state Description Low (when MU709s-2 MU709s-2 is powered on.
  • Page 27 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Figure 3-3 Connections of the POWER_ON_OFF pin Power-On Time Sequence After VBAT has been applied and is stable, the POWER_ON_OFF signal is pulled down, and then the module will boot up.

  • Page 28: Reset The Module

    > 4.0 D+ low 3.4.3 Reset the Module MU709s-2 module does not support hardware reset, you can send the AT command to reset the module. For the details about the AT command, please refer to the HUAWEI MU709 Series HSPA+ LGA Module AT Command Interface Specification.

  • Page 29: Wakeup_Out Signal

    Figure 3-7 shows recommended circuit of the WAKEUP_OUT pin. Figure 3-7 Connections of the WAKEUP_OUT pin 3.4.6 SLEEP_STATUS Signal SLEEP_STATUS signal is used to indicate the sleep status of MU709s-2. The external devices can get to know whether the module is in sleep mode by reading SLEEP_STATUS pin.

  • Page 30: Led_Mode Signal

    Interfaces Figure 3-8 shows recommended circuit of the SLEEP_STATUS pin. Figure 3-8 Connections of the SLEEP_STATUS pin 3.4.7 LED_MODE Signal MU709s-2 provides an LED_MODE signal to indicate the work status. Table 3-7 State of the LED_MODE pin Operating Status LED_MODE Outputs: low (0.1s)-high (0.1s)-low...

  • Page 31: Uart Interface

    As the UART0 interface supports signal control through standard modem handshake, AT commands are entered and serial communication is performed through the UART0 interface. The UART1 (2-wire UART) interface is provided for only debugging by MU709s-2 module. The UART has the following features: ...

  • Page 32: Circuit Recommended For The Uart Interface

    1.35 1.80 2.10 0.45 3.5.2 Circuit Recommended for the UART Interface Figure 3-10 Connection of the UART interface in the MU709s-2 module (DCE) with the host (DTE) Huawei Proprietary and Confidential Issue 03 (2014-09-18) Copyright © Huawei Technologies Co., Ltd.

  • Page 33: Usb Interface

    2BDescription of the Application Hardware Guide Interfaces The RS-232 chip (must support 921600 bit/s) can be used to connect the MU709s-2 module with UART0. In this connection, the Complementary Metal Oxide Semiconductor (CMOS) logic level and the Electronic Industries Association (EIA) level are converted mutually.

  • Page 34: Usim Card Interface

    C3 according to the actual PCB which is integrated 30 mm × 30 mm LGA module 3.7 USIM Card Interface 3.7.1 Overview The MU709s-2 module provides a USIM card interface complying with the ISO 7816-3 standard and supports both Class B and Class C USIM cards. Table 3-10 USIM card interface signals Typ.

  • Page 35: Circuit Recommended For The Usim Card Interface

    C=3.00 V 3.7.2 Circuit Recommended for the USIM Card Interface As the MU709s-2 module is not equipped with an USIM socket, you need to place an USIM socket on the user interface board. Figure 3-12 shows the circuit of the USIM card interface.

  • Page 36: Audio Interface

    Ground pin of the ESD protection component is well connected to the power Ground pin that supplies power to the MU709s-2 module. 3.8 Audio Interface MU709s-2 provided one PCM digital audio interface. Table 3-11 lists the signals on the digital audio interface. Table 3-11 Signals on the digital audio interface...
  • Page 37 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Figure 3-13 Circuit diagram of the interface of the PCM (MU709s-2 is used as PCM master) Figure 3-14 Circuit diagram of the interface of the PCM (MU709s-2 is used as PCM slave) ...

  • Page 38: General Purpose I/O Interface

    Interfaces 3.9 General Purpose I/O Interface The MU709s-2 module provides 5 GPIO pins for customers to use controlling signals which are worked at 1.8 V CMOS logic levels. Customers can use AT command to control the state of logic levels of 5 GPIO output signal. See the...

  • Page 39: Rf Antenna Interface

    HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces 3.11 RF Antenna Interface The MU709s-2 module provided two antenna pads (MAIN_ANT and AUX_ANT) for connecting the external antennas. Table 3-14 Definition of the antenna pads Pin Name Description Parameter Min.(V)
  • Page 40 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Figure 3-16 RF signal layout design about MAIN_ANT for reference (the same for AUX_ANT) For the PCB designed by the user, the impedance of all the RF signal tracks must be 50 Ω.
  • Page 41 HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces Figure 3-17 Complete structure of the microstrip Figure 3-18 Complete structure of the stripline Figure 3-19 Pad for the RF interface Huawei Proprietary and Confidential Issue 03 (2014-09-18)

  • Page 42: Reserved Interface

    Please use impedance simulation tool to calculate RF MAIN pad impedance. The RF MAIN pad dimension of MU709s-2 is 1.1 mm (L) x 0.9 mm (W). You can get the impedance with lower than 50 Ω calculated by the impedance simulation tool. Since the target impedance is 50 Ω...

  • Page 43: Nc Interface

    HUAWEI MU709s-2 HSPA+ LGA Module 2BDescription of the Application Hardware Guide Interfaces 3.13 NC Interface The MU709s-2 module has some NC pins. All NC pins should not be connected. Please keep these pins open. Table 3-16 NC pin Min.( Typ.( Max.(...

  • Page 44: Rf Specifications

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 3BRF Specifications RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the MU709s-2 module, including:  Operating Frequencies  Conducted RF Measurement  Conducted Rx Sensitivity and Tx Power ...

  • Page 45: Conducted Rf Measurement

    The instrument compensation needs to be set according to the actual cable conditions. 4.3.2 Test Standards Huawei modules meet 3GPP test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed. 4.4 Conducted Rx Sensitivity and Tx Power 4.4.1 Conducted Receive Sensitivity...

  • Page 46: Conducted Transmit Power

    In addition, the transmission cable from the antenna port of MU709s-2 to the antenna is also part of the antenna. The cable loss increases with the cable length and the frequency. It is recommended that the cable loss is as low as possible, for example, MXHP32HP1000 made by Murata or equivalent.
  • Page 47  Antenna direction The primary antenna must be placed as near as possible to the MU709s-2 to minimize the cable length. The diversity antenna needs to be installed perpendicularly to the primary antenna. The diversity antenna can be placed farther away from the MU709s-2.
  • Page 48 For this reason, the receiving performance is optimal. The following radiation patterns are recommended for the antenna of MU709s-2. Primary/diversity antenna: omnidirectional In addition, the diversity antenna’s pattern should be complementary with the primary antenna's pattern.

  • Page 49: Interference

    RF transmission cable into account when measuring any of the preceding antenna indicators.  Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. 4.5.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module.

  • Page 50: Electrical And Reliability Features

    EMC and ESD Features 5.2 Absolute Ratings Table 5-1 lists the absolute ratings for the MU709s-2 module. Using the MU709s-2 module beyond these conditions may result in permanent damage to the module. Table 5-1 Absolute ratings for the MU709s-2 module...

  • Page 51: Power Supply Features

    °C Ambient temperature for storage –40 °C [1]: When the MU709s-2 module works outside of the range from –40°C to +85°C, NOT all its RF performances comply with 3GPP specifications. 5.4 Power Supply Features 5.4.1 Input Power Supply Table 5-3 lists the requirements for input power of the MU709s-2 module.

  • Page 52: Power Consumption

    Table 5-5 to Table 5-8 . The power consumption listed in this section is tested when the power supply of MU709s-2 module is normal voltage (3.8 V) and all of Test values are measured at room temperature. Table 5-5 Averaged power off DC power consumption of MU709s-2 Description Test Value (Unit: µA)
  • Page 53 Module is powered up MFRMS =5 (1.175s) Module is registered on the network. no data is transmitted USB is in active. Table 5-7 Averaged Data Transmission DC power consumption of MU709s-2 (HSPA/WCDMA) Test Value Description Band Power (dBm) (Unit: mA)
  • Page 54 HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Description Test Value Units Configuration 4 Up/1 Down GPRS900 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down GPRS1800 1 Up/1 Down...

  • Page 55: Reliability Features

    Table 4-3 , for Max. data throughput, see 2.2 Function Overview, which are listed in Table 2-1 . 5.5 Reliability Features Table 5-9 lists the test conditions and results of the reliability of the MU709s-2 module. Table 5-9 Test conditions and results of the reliability of the MU709s-2 module Item...
  • Page 56 HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample size Results Low-tempera  Temperature: –40ºC IEC60068- 3 pcs/group Visual inspection: ture  Operation mode: working operating with service connected Function test: ok ...
  • Page 57 HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample size Results Sine  Frequency range: 5 Hz to JESD22-B1 3 pcs/group Visual inspection: vibration 200 Hz 03-B  Acceleration: 1 Grms Function test: ok ...

  • Page 58: Emc And Esd Features

    The following are the EMC design comments:  Attention should be paid to static control in the manufacture, assembly, packaging, handling and storage process to reduce electrostatic damage to HUAWEI module.  RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if the antenna port is protected by TVS (Transient Voltage Suppressor), which is resolved by making some adjustment on RF match circuit.
  • Page 59  Effective shielding measures must be taken on the ESD sensitive materials that are transported or stored outside the EPA. HUAWEI MU709s-2 module does not include any protection against overvoltage. Huawei Proprietary and Confidential Issue 03 (2014-09-18) Copyright © Huawei Technologies Co., Ltd.

  • Page 60: Mechanical Specifications

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 5BMechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the process design and mechanical specifications:  Storage Requirement  Moisture Sensitivity  Dimensions and Interfaces  Packaging  Label  Customer PCB Design ...

  • Page 61: Dimensions And Interfaces

    CEN-X 1.50 3.50 CEN-Y 14.00 22.50 27.00 3x 0.81 27.20 6.5 Packaging HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons. Huawei Proprietary and Confidential Issue 03 (2014-09-18) Copyright © Huawei Technologies Co., Ltd.
  • Page 62 HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 5BMechanical Specifications The following figure shows the packaging. Huawei Proprietary and Confidential Issue 03 (2014-09-18) Copyright © Huawei Technologies Co., Ltd.

  • Page 63: Label

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 5BMechanical Specifications 6.6 Label The label is made from deformation-resistant, fade-resistant, and high-temperature-resistant material and is able to endure the high temperature of 260°C. Figure 6-2 MU709s-2 label Model:MU709s-2 28mm R=0.8mm C1.0 28mm The picture mentioned above is only for reference.

  • Page 64: Solder Mask

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 5BMechanical Specifications Figure 6-3 MU709s-2 Footprint design (unit: mm) 6.7.3 Solder Mask NSMD is recommended. In addition, the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved.

  • Page 65: Stencil Design

    Figure 6-4 Recommended stencil design of LGA module (unit: mm) The stencil design has been qualified for HUAWEI motherboard assembly, customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect.

  • Page 66: Specification Of Rework

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 5BMechanical Specifications Figure 6-5 Reflow profile Table 6-2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone 60s–120s Heating rate: 0.5°C/s–2°C/s (40°C–150°C) Soak zone (t1–t2): 60s–120s Heating rate: < 1.0°C/s (150°C–200°C) Reflow zone (> 217°C) (t3–t4): 30s–90s...

  • Page 67: Preparations Of Rework

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 5BMechanical Specifications 6.9.2 Preparations of Rework  Remove barrier or devices that can’t stand high temperature before rework.  If the device to be reworked is beyond the storage period, bake the device according to Table 6-1 .

  • Page 68: Module Installation

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 5BMechanical Specifications It is recommended that a fixture and a mini-stencil be made to apply the solder paste in the rework. 6.9.5 Module Installation Install the module precisely on the Motherboard and ensure the right installation direction of the module and the reliability of the electrical connection with the PCB.

  • Page 69: Certifications

    This chapter gives a general description of certifications of MU709s-2. 7.2 Certifications The certification of MU709s-2 has been implemented. Table 7-1 shows certifications the MU709s-2. For more demands, please contact us for more details about this information. Table 7-1 Product Certifications Certification...

  • Page 70: Safety Information

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 7BSafety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.

  • Page 71: Traffic Security

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 7BSafety Information  Area indicated with the "Power off bi-direction wireless equipment" sign  Area where you are generally suggested to stop the engine of a vehicle 8.4 Traffic Security  Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving.

  • Page 72: Laws And Regulations Observance

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide 7BSafety Information 8.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 8.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device.

  • Page 73: Appendix A Circuit Of Typical Interface

    HUAWEI MU709s-2 HSPA+ LGA Module Hardware Guide Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface J301 J302 C371 22pF MAIN_ANT C365 22pF 0 Ω R341 USIM_VCC R342 0 Ω USIM_RESET R344 SMA6251A1_060_20GHT50GH_50 R343 0 Ω 0 Ω...

  • Page 74: Appendix B Acronyms And Abbreviations

    HUAWEI MU709s-2 HSPA+ LGA Module 9BAppendix B Acronyms and Hardware Guide Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP Third Generation Partnership Project 8PSK 8 Phase Shift Keying Auxiliary Bit Error Rate BLER Block Error Rate BIOS...
  • Page 75 HUAWEI MU709s-2 HSPA+ LGA Module 9BAppendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Electromagnetic Compatibility Electrostatic Discharge European Union Federal Communications Commission GMSK Gaussian Minimum Shift Keying GPIO General-purpose I/O GPRS General Packet Radio Service Global System for Mobile Communication...
  • Page 76 HUAWEI MU709s-2 HSPA+ LGA Module 9BAppendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Product Identity Power Management Unit Radio Frequency Restriction of the Use of Certain Hazardous RoHS Substances Short Message Service Total Isotropic Sensitivity Total Radiated Power...

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