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Huawei MU509 Series Hardware Manual

Hsdpa lga module
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HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
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09
Date
2014-03-06
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Summary of Contents for Huawei MU509 Series

  • Page 1 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Issue Date 2014-03-06...
  • Page 2 Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.
  • Page 3 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version 2010-11-12 Creation 2011-04-18 Updated Overview Updated Table 2-1 Feature Updated 2.4 Application Block Diagram Updated 3.1 About This Chapter...
  • Page 4 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide About This Document Document Date Chapter Descriptions Version 5.5.2 Updated 5.5.2 Power Consumption Updated 6.2 Dimensions and interfaces of MU509 Added 6.3 Customer PCB Pad Design Updated 6.4 Label Added 7 Certifications...
  • Page 5 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide About This Document Document Date Chapter Descriptions Version 5.5.2 Update Table 5-6 DC power consumption (Power off mode and Standby mode) and Table 5-7 DC power consumption (Idle mode) Added the process design...
  • Page 6 MU509-c MU509-g HUAWEI MU509-1 Summary This document provides information about the major functions, supported services, system architecture, and technical references of HUAWEI MU509 Series HSDPA LGA Module. The following table lists the contents of this document. Chapter Details 1 Introduction Describes the short introduction of the product.
  • Page 7 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide About This Document Chapter Details 10 Appendix B Acronyms and Lists the acronyms and abbreviations Abbreviations mentioned in this document. Huawei Proprietary and Confidential Issue 09 (2014-03-06) Copyright © Huawei Technologies Co., Ltd.

  • Page 8: Table Of Contents

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Contents Contents 1 Introduction..........................11 2 Overall Description ........................12 2.1 About This Chapter ......................... 12 2.2 Function Overview.......................... 12 2.3 Circuit Block Diagram ........................14 2.4 Application Block Diagram ......................16 3 Description of the Application Interfaces ................
  • Page 9 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Contents 3.10 JTAG Interface ..........................47 3.11 RF Antenna Interface........................48 3.12 NC Pins ............................48 4 RF Specifications ......................... 49 4.1 About This Chapter ......................... 49 4.2 Antenna Installation Guidelines ...................... 49 4.3 Operating Frequencies ........................
  • Page 10 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Contents 6.8.1 General Description of Assembly Processes ................ 80 6.8.2 Stencil Design ........................80 6.8.3 Reflow Profile ........................81 6.9 Specification of Rework ........................82 6.9.1 Process of Rework ........................ 82 6.9.2 Preparations of Rework ......................83 6.9.3 Removing of the Module......................

  • Page 11: Introduction

    Introduction This document describes the hardware application interfaces and air interfaces that are provided when the HUAWEI MU509 Series HSDPA LGA Module (hereinafter referred to as the MU509 module) is used. This document helps you to understand the interface specifications, electrical features, and related product information of the MU509 module.

  • Page 12: Overall Description

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the MU509 module and provides:  Function Overview  Circuit Block Diagram  Application Block Diagram 2.2 Function Overview...
  • Page 13 Storage Power Voltage 3.3 V to 4.2 V (3.8 V is recommended.) AT Commands For MU509-b, MU509-g and HUAWEI MU509-1, see the HUAWEI MU509 HSDPA LGA Module AT Command Interface Specification. For MU509-c, see the HUAWEI MU509-c HSDPA LGA Module AT Command Interface Specification.

  • Page 14: Circuit Block Diagram

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Overall Description Feature Description WCDMA CS: UL 64 kbps/DL 64 kbps WCDMA PS: UL 384 kbps/DL 384 kbps HSDPA: DL 3.6 Mbps Internet TCP/IP, UDP/IP, PPP protocol Protocols Applications SVD (Simultaneous Voice and Data), only for 3G ...
  • Page 15 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Overall Description Figure 2-1 Circuit block diagram of the MU509 module UART Single Chip USIM POWER_ON_OFF BASEBAND WAKEUP_IN/OUT RF PA RESIN_N GPIO AUDIO JTAG SWITCH VBAT POWER VCC_EXT1 MANAGER VCC_EXT2 MAIN_ANT Only Telematics version supports the audio function.

  • Page 16: Application Block Diagram

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Overall Description 2.4 Application Block Diagram Figure 2-2 Application block diagram of the MU509 module UART Interface The module supports 8-wire UART. USB Interface The USB interface supports USB 2.0 full speed standard.

  • Page 17: Description Of The Application Interfaces

    The MU509 module uses a 145-pin LGA as its external interface. For details about the module and dimensions of the LGA, see " 6.4 Dimensions and interfaces". If DTE supports other Huawei LGA modules, such as modules with system of CDMA, TD-SCDMA or HSPA, please refer to...
  • Page 18 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Table 3-1 Definitions of pins on the LGA interface Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. Not connected, please keep this pin open. Not connected, please keep this pin open.
  • Page 19 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. Not connected, please keep this pin open. Not connected, please keep this pin open. Not connected, please keep this pin open.
  • Page 20 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. MIC1_P (Only Telematics version supports audio function, Data only version does not support this function) Positive pole of the input of...
  • Page 21 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. Ground Ground Ground Not connected, please keep this pin open. Not connected, please keep this pin open.
  • Page 22 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. UART_CTS UART Clear to Send –0.3 POWER_ON_OFF System power-on or Pulled power-off up on chip Not connected, please keep this pin open.
  • Page 23 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. SPKR_OUT_P (Only Telematics version supports audio function, Data only version does not support this function) Positive pole of the output...
  • Page 24 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. Not connected, please keep this pin open. Ground Not connected, please keep this pin open. Not connected, please keep this pin open.
  • Page 25 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. Thermal Ground Pad Thermal Ground Pad Thermal Ground Pad Thermal Ground Pad P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital ...

  • Page 26: Power Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the MU509 module. Figure 3-1 Bottom view of sequence of LGA interface pins 31 32 33 34 35 36 37 38 39 40 41 42...

  • Page 27: Vbat Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces  VCC_EXT1 pin for external power output  VCC_EXT2 pin for external power output  SIM_VCC pin for SIM card power output Table 3-2 lists the definitions of the pins on the power supply interface.

  • Page 28: Vcoin Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces A low-dropout (LDO) regulator or switch power with current output of more than 3 A is recommended for external power supply. Furthermore, at least five 220 µF storage capacitors are connected in parallel at the power interface of the MU509 module.
  • Page 29 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Table 3-3 Keep-alive capacitor values vs. SMPL timer settings SMPL timer setting Capacitor value Capacitor package (X5R) 1.5 μF 0.5s 0805 3.3 μF 1.0s 0805 4.7 μF 1.5s...

  • Page 30: Output Power Supply Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-3 VCOIN interface circuit VCOIN 2.2 kΩ Module Coin Cell (DCE) 100 nF 3.3.5 Output Power Supply Interface Output power supply interface includes VCC_EXT1, VCC_EXT2 and SIM_VCC.

  • Page 31: Input Signal Control Pins

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Table 3-5 Pins on the signal control interface Pin Name Description DC Characteristics (V) Min. Typ. Max. Pin for controlling Pulled up POWER_ON_OFF power-on and on chip...
  • Page 32 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces As the RESIN_N and POWER_ON_OFF signals are relatively sensitive, it is recommended that you install a 10 nF capacitor near the RESIN_N and POWER_ON_OFF pins of the interface for filtering. In addition, when you design a circuit on the PCB of the interface board, it is recommended that the circuit length not exceed 20 mm and that the circuit be kept at a distance of 2.54 mm (100 mil) at least...
  • Page 33 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-5 Power on timing sequence Table 3-6 Power on timing Parameter Comments Time(Nominal values) Units POWER_ON_OFF turn on time. 0.5 < T < 1 POWER_ON_OFF Valid to USB D+...

  • Page 34: Output Signal Control Pin

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces For detailed information about power supply design and printed circuit board (PCB) design, see HUAWEI Module Power Supply Design Guide and the HUAWEI LGA Module PCB Routing Design Guide.
  • Page 35 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Operating Status LED_STATUS LED_MODE The 2G network is The indicator blinks Light off successfully registered. once each time. The dial-up connection is set up for accessing 2G...
  • Page 36 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Blinking Twice Each Time Figure 3-10 Status when the indictor blinks twice each time 100ms 100ms 100ms Light on Light off 1 cycle: 3s External Circuits Figure 3-11 shows the recommended circuits of the LED_MODE and LED_STATUS pins.

  • Page 37: Wakeup_In Signal

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-12 LED Typical Electro-Optical Characteristics Curves 3.4.4 WAKEUP_IN Signal The DTE controls the sleep and wakeup status of the MU509 module through the WAKEUP_IN signal. The DTE can control the MU509 module to enter forced sleep...

  • Page 38: Wakeup_Out Signal

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces The level status of WAKEUP_IN signal is high by default. 3.4.5 WAKEUP_OUT Signal The WAKEUP_OUT signal is used to wake up the external system. WAKEUP_OUT signal is low by default. When a phone call or an SMS is coming, the MU509 module will output a high pulse which lasts for 1s.

  • Page 39: Uart Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces 3.5 UART Interface 3.5.1 Overview The MU509 module provides the UART (8-wire UART) interface for one asynchronous communication channel. As the UART interface supports signal control through standard modem handshake, AT commands are entered and serial communication is performed through the UART interface.

  • Page 40: Circuit Recommended For The Uart Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces 3.5.2 Circuit Recommended for the UART Interface Figure 3-16 shows the connection of the UART interface in the MU509 module (DCE) with the host (DTE). Figure 3-16 Connection of the UART interface in the MU509 module (DCE) with the host...

  • Page 41: Sim Card Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces According to USB protocol, for bus timing or electrical characteristics of MU509 USB signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0. Figure 3-17 Recommended circuit of USB interface...

  • Page 42: Circuit Recommended For The Sim Card Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Table 3-11 SIM card interface signals Pin No. Pin Name Description DC Characteristics (V) Min. Typ. Max. Power source for SIM_VCC 1.8/2.85 the external USIM. External USIM SIM_DATA 1.8/2.85...
  • Page 43 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-19 Pin definition of SIM Socket pin1: SIM_VCC pin2: SIM_RESET pin3: SIM_CLK pin4: pin5: NULL pin6: SIM_DATA Huawei Proprietary and Confidential Issue 09 (2014-03-06) Copyright © Huawei Technologies Co., Ltd.

  • Page 44: Audio Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces  To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the SIM card socket should be placed near the LGA interface (it is recommended that the PCB circuit connecting the LGA interface and the SIM card socket not exceed 100 mm), because a long circuit may lead to wave distortion, thus affecting signal quality.

  • Page 45: Digital Audio

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Figure 3-20 Circuit diagram of the interface of the first audio channel MIC1_P 100 pF MIC1_N ESD protection 33 pF 33 pF Module (DCE) EAR_OUT_P Network 100 pF...

  • Page 46: Primary Mode

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Table 3-12 Signals on the digital audio interface Pin No. Pin Name Description DC Characteristics (V) Min. Typ. Max. –0.3 PCM_SYNC PCM interface sync –0.3 PCM_DIN PCM I/F data in –0.3...

  • Page 47: General Purpose I/O Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces 3.9 General Purpose I/O Interface The LGA module provides 8 channels GPIO pins for customers to use controlling signals which are worked at 2.6 V CMOS logic levels. Customers can use AT command to control the state of logic levels of eight channels GPIO output signal.

  • Page 48: Rf Antenna Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Description of the Application Interfaces Pin No. Pin Name Description DC Characteristics (V) Min. Typ. Max. RESIN_N Reset module. –0.3 3.11 RF Antenna Interface The MU509 module provides an RF antenna pad for connecting an external antenna.

  • Page 49: Rf Specifications

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide RF Specifications RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the MU509 module, including:  Antenna Installation Guidelines  Operating Frequencies  Conducted RF Measurement  Conducted Rx Sensitivity and Tx Power ...

  • Page 50: Conducted Rf Measurement

    The instrument compensation needs to be set according to the actual cable conditions. 4.4.2 Test Standards Huawei modules meet all 3GPP test standards relating to both 2G and 3G. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed.

  • Page 51: Conducted Transmit Power

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide RF Specifications Table 4-2 MU509 conducted Rx sensitivity 3GPP Protocol Item MU509 Test Value (dBm) Claim (dBm) Min. Typ. GSM850 GMSK (BER < 2.43%) < –102 –109 –106 8PSK (MCS5, BLER <...

  • Page 52: Antenna Design Requirements

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide RF Specifications Item 3GPP Protocol MU509 Test Value (dBm) Claim (dBm) Min. Typ. Max. 8PSK(1Tx Slot) 24–30 25.5 28.5 GSM900 GMSK(1Tx Slot) 31–35 32.5 8PSK(1Tx Slot) 24–30 25.5 28.5 GSM1800 GMSK(1Tx Slot) 28–32...

  • Page 53: Interference

    RF transmission cable into account when measuring any of the preceding antenna indicators.  Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. 4.6.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module.

  • Page 54: Gsm/Wcdma Antenna Requirements

    Use an LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module.
  • Page 55 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide RF Specifications  Pattern shape  Envelope correlation coefficient Active Tests  TRP: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems  TIS: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems Figure 4-1 shows the SATIMO microwave testing chamber.

  • Page 56: Electrical And Reliability Features

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features of the interfaces in the MU509 module, including:  Extreme Operating Conditions ...

  • Page 57: Operating And Storage Temperatures And Humidity

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features is 2.6 V or 1.8 V. To get the details about the voltage of V , please refer to Table 3-1 . 5.3 Operating and Storage Temperatures and Humidity Table 5-2 lists the operating and storage temperatures and humidity for the MU509 module.

  • Page 58: Power Supply Features

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Parameter Description Minimum Value Maximum Value Unit Low-level output 0.45 voltage High-level output current Low-level output –1.5 current is 2.6 V or 1.8 V. To get the details about the voltage of V , please refer to Table 3-1 .

  • Page 59: Power Consumption

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Table 5-5 Requirements for input current of the MU509 module Power Peak (Maximum) Normal (Maximum) 3.8 V 2750 mA 1100 mA 5.5.2 Power Consumption The power consumptions of MU509 in different scenarios are respectively listed in Table 5-6 to Table 5-12 .
  • Page 60 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Description Bands Test Value (mA) Notes/Configuration Typical GSM/GPRS/EDGE GSM bands Module is powered up. MFRMS=5 (1.175s) Module is registered on the network, and no data is transmitted. USB is in active.
  • Page 61 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Description Band Test Value (mA) Notes/Configuration Typical MU509-1 23.5 dBm Tx Power HSDPA Band I 0 dBm Tx Power MU509-b (IMT2100) 10 dBm Tx Power 23.5 dBm Tx Power...
  • Page 62 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Description Test Value (mA) Notes/Configuration Typical 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down GPRS900 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down...
  • Page 63 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Description Test Value (mA) Notes/Configuration Typical 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down EDGE1800 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down...
  • Page 64 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Description Test Value (mA) Notes/Configuration Typical 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down GPRS1800 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down...
  • Page 65 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Description Test Value (mA) Notes/Configuration Typical 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down EDGE1900 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down...
  • Page 66 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Description Test Value (mA) Notes/Configuration Typical 2 Up/1 Down 4 Up/1 Down GPRS1900 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down...
  • Page 67 Hardware Guide Electrical and Reliability Features Description Test Value (mA) Notes/Configuration Typical 2 Up/1 Down 4 Up/1 Down Table 5-12 Averaged DC power consumption of HUAWEI MU509-1 (GPRS/EDGE) Description Test Value (mA) Notes/Configuration Typical GPRS850 1 Up/1 Down 2 Up/1 Down...
  • Page 68 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Description Test Value (mA) Notes/Configuration Typical 4 Up/1 Down EDGE850 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down...

  • Page 69: Reliability Features

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features All power consumption test configuration can be referenced by GSM Association Official Document TS.09: Battery Life Measurement and Current Consumption Technique. Test condition: For max. Tx power, see 4.5.2 Conducted Transmit Power, which are listed ...
  • Page 70 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample Results size  Damp heat High temperature: 55ºC JESD22- 3 pcs/group Visual inspection: ok cycling A101-B  Low temperature: 25ºC Function test: ok ...

  • Page 71: Emc And Esd Features

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample Results size  Shock test Half-sine wave shock JESD-B1 3 pcs/group Visual inspection: ok 04-C  Peak acceleration: 30 Function test: ok Grms RF specification: ok ...
  • Page 72 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features  Resistors in parallel and a 10 nF capacitance should be added on RESIN_N and POWER_ON_OFF signal to avoid shaking, and the distance between the capacitor and the related pins should be less than 100 mil.
  • Page 73 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Electrical and Reliability Features The HUAWEI MU509 module does not include any protection against overvoltage. Huawei Proprietary and Confidential Issue 09 (2014-03-06) Copyright © Huawei Technologies Co., Ltd.

  • Page 74: Process Design

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Process Design Process Design 6.1 About This Chapter This chapter describes the process design and mechanical specifications:  Storage Requirement  Moisture Sensitivity  Dimensions and interfaces  Packaging  Label ...

  • Page 75: Dimensions And Interfaces

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Process Design Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033. 6.4 Dimensions and interfaces Figure 6-1 shows the dimensions in details. Figure 6-1 Dimensions (unit: mm) Huawei Proprietary and Confidential Issue 09 (2014-03-06) Copyright ©...

  • Page 76: Packaging

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Process Design 6.5 Packaging HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons. 323.90 30.40 0.10 *6.60 3.50 22.42 0.15 56.08 89.74 123.40 157.06 190.72 ESD PPE 224.38...

  • Page 77: Label

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Process Design  All materials used must meet eco-friendly requirements.  According to the requirements and test methods specified in EIA 541, the surface resistance Ω and triboelectricity must be lower than 100 V.
  • Page 78 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Process Design Figure 6-2 Label for MU509-b, MU509-c and MU509-g Figure 6-3 Label for HUAWEI MU509-1  The picture mentioned above is only for reference. The material and surface finishing and coatings which used have to make satisfied with the ...

  • Page 79: Customer Pcb Design

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Process Design 6.7 Customer PCB Design 6.7.1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel, immersion Gold (ENIG). Organic Solderability Preservative (OSP) may also be used, ENIG preferred. 6.7.2 PCB Pad Design...

  • Page 80: Requirements On Pcb Layout

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Process Design 6.7.4 Requirements on PCB Layout  To reduce deformation, a thickness of at least 1.0 mm is recommended.  Other devices must be located more than 3 mm (5 mm recommended) away from the LGA module.

  • Page 81: Reflow Profile

    Figure 6-5 Recommended stencil design of LGA module PCB PADS Stencil design Unit: mm The stencil design has been qualified for HUAWEI mainboard assembly, customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect. 6.8.3 Reflow Profile For the soldering temperature of the LGA module, see the following figure.

  • Page 82: Specification Of Rework

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Process Design Figure 6-6 Reflow profile Table 6-2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone 60s–120s Heating rate: 0.5°C/s–2°C/s (40°C–150°C) Soak zone (t1–t2): 60s–120s Heating rate: < 1.0°C/s (150°C–200°C) Reflow zone (> 217°C) (t3–t4): 30s–90s...

  • Page 83: Preparations Of Rework

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Process Design 6.9.2 Preparations of Rework  Remove barrier or devices that cannot stand high temperature before rework.  If the device to be reworked is beyond the storage period, bake the device according to Table 6-1 .

  • Page 84: Module Installation

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Process Design It is recommended that a fixture and a mini-stencil be made to apply the solder paste in the rework. 6.9.5 Module Installation Install the module precisely on the module and ensure the right installation direction of the module and the reliability of the electrical connection with the PCB.

  • Page 85: Certifications

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Certifications Certifications 7.1 About This Chapter This chapter gives a general description of certifications for MU509. 7.2 Certifications Table 7-1 shows certifications the MU509 module has been implemented. For more demands, please contact us for more details about this information.
  • Page 86 HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Certifications Certification Model name MU509-b MU509-c MU509-g HUAWEI MU509-1 SGS RoHS PVC-Free √ √ √ PTCRB Huawei Proprietary and Confidential Issue 09 (2014-03-06) Copyright © Huawei Technologies Co., Ltd.

  • Page 87: Safety Information

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.

  • Page 88: Traffic Security

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Safety Information  Area indicated with the "Power off bi-direction wireless equipment" sign  Area where you are generally suggested to stop the engine of a vehicle 8.4 Traffic Security  Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving.

  • Page 89: Laws And Regulations Observance

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Safety Information 8.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 8.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device.

  • Page 90: Fcc Statement

    Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Huawei Proprietary and Confidential Issue 09 (2014-03-06)

  • Page 91: Appendix A Circuit Of Typical Interface

    HUAWEI MU509 Series HSDPA LGA Module Hardware Guide Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface LGA Interface POWER SUPPLY U102 U101 HPA00615DRVR USB_5V J101 5V_P **1.8p MAIN_ANT C104 MAIN_ANT EAR_OUT_N USB_5V R105 EAR_OUT_P R101 USB_DM...

  • Page 92: Appendix B Acronyms And Abbreviations

    HUAWEI MU509 Series HSDPA LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP Third Generation Partnership Project 8PSK 8 Phase Shift Keying Application Process Bit Error Rate BLER Block Error Rate...
  • Page 93 HUAWEI MU509 Series HSDPA LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion GMSK Gaussian MinimumSshift Keying GPIO General-purpose I/O GPRS General Packet Radio Service International Standards Organization Low-Dropout Light-Emitting Diode Land Grid Array Multi-chip Package...
  • Page 94 HUAWEI MU509 Series HSDPA LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Universal Serial Bus USIM Universal Subscriber Identity Module VSWR Voltage Standing Wave Ratio WEEE Waste Electrical and Electronic Equipment WCDMA Wideband CODE Division Multiple Access...

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