Sony MDR-IF5000 Service Manual
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Sony MDR-IF5000 Service Manual

Cordless stereo headphones
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SERVICE MANUAL
Ver 1.0 1998. 11
•
MDR-IF5000 is the component model block one in
MDR-DS5000.
COMPONENT MODEL NAME FOR MDR-DS5000
DIGITAL SURROUND PROCESSOR
CORDLESS STEREO HEADPHONES
MICROFILM
MDR-IF5000
DP-IF5000
MDR-IF5000
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
CORDLESS STEREO HEADPHONES
– 1 –

SPECIFICATIONS

Modulation System
Frequency modulation
Carrier wave frequency Right channel 2.8 MHz
Left channel 2.3 MHz
Frequency response
12 – 24,000 Hz
Power requirements
Rechargeable Ni-Cd
batteries (supplied) or
R6 (size AA) batteries
(dry-cell or
rechargeable, sold
separately)
Mass
Approx. 280 g
(including the
supplied rechargeable
Ni-Cd batteries)
Design and specifications are subject to
change without notice.
E Model
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  • Page 1 MDR-IF5000 SERVICE MANUAL E Model Ver 1.0 1998. 11 SPECIFICATIONS • MDR-IF5000 is the component model block one in MDR-DS5000. Modulation System Frequency modulation Carrier wave frequency Right channel 2.8 MHz COMPONENT MODEL NAME FOR MDR-DS5000 Left channel 2.3 MHz Frequency response 12 –...
  • Page 4 SECTION 2 DISASSEMBLY • The equipment can be removed using the following procedure. Frame assy Hanger (L) Band Assy, Head Frame assy Hanger (R) RX board Band Assy, Head Note : Follow the disassembly procedure in the numerical order given. 2-1.
  • Page 5 2-4. RX BOARD 1 P 2.6X6 2 RX board 2-5. BAND ASSY, HEAD 3 stopper, PC board 5 band assy, head 2 RX SW board 1 wire When installing, take care to avoid extrusion of wire from the hanger. 4 claws –...
  • Page 6 1.2 V. 5. The processor section is used as jig to adjust the headphones section (MDR-IF5000). 6. Adjustment is made with the RX SW board and RX PD1 and RX PD2 boards (for both L-ch and R-ch) connected to the RX TP11 board with wires (normal part).
  • Page 7 MDR-IF5000 SECTION 4 DIAGRAMS 4-1. BLOCK DIAGRAM AUDIO (L) MIXER LIMITER IC31 SQUELCH TRIGGER WITH L34,35 HYSTERESIS TUNING QUAD COIL MUTE (+3.0V) (+1.7V) INFRARED OSCILLATOR SENSOR D1-4 MIXER LIMITER DRIVER AMP (L-CH) MIXER RF AMP BUFFER 2.3MHz BPF IC32 MIXER...
  • Page 8 MDR-IF5000 4-2. PRINTED WIRING BOARDS L-CH R-CH INFRARED SENSOR TP11 DRY BATTERY SIZE "AA" (IEC DESIGNATION R6) 2PCS, 3V NICKEL CADMIUM BATTERY (NC-AA) 700mAh 2.4V R-CH L-CH • Semiconductor Location Ref. No. Location C-13 F-13 C-10 F-10 IC31 IC32 IC51...
  • Page 9 MDR-IF5000 4-3. SCHEMATIC DIAGRAM • Refer to page 13 for IC Block Diagrams. Note: • All capacitors are in µF unless otherwise noted. pF: µµF • Total current is measured with POWER ON (no-sig- 50 WV or less are not indicated except for electrolytics nal) mode.

  • Page 10: Ic Block Diagrams

    • IC Block Diagrams IC31, 51 SC111711DR2 MIXER SCAN SQUELCH FILTER FILTER RECOVERD INPUT MUTE CONTROL OUTPUT INPUT AUDIO – FILTER SQUELCH TRIGGER WITH HYSTERESIS DEMODULATOR MIXER LIMITER OSCILLATOR MIXER LIMITER QUAD OUTPUT INPUT COIL CRYSTAL DECOUPLING IC32, 52 MC34119DTBEL BIAS CIRCUIT –...
  • Page 11 SECTION 5 EXPLODED VIEW NOTE: • The mechanical parts with no reference • -XX and -X mean standardized parts, so number in the exploded views are not supplied. they may have some difference from the • Items marked “*” are not stocked since original one.
  • Page 12 SECTION 6 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in • Items marked “*” are not stocked since When indicating parts by reference the parts list may be different from the they are seldom required for routine service. number, please include the board.
  • Page 13 MDR-IF5000 RX PD1 RX PD2 RX SW Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 1-216-049-11 RES,CHIP 1/10W 1-671-720-11 RX SW BOARD 1-216-073-00 METAL CHIP 1/10W ************ 1-216-089-00 RES,CHIP 1/10W 1-216-063-00 RES,CHIP 3.9K 1/10W < SWITCH >...
  • Page 14 Ver 1.1 1999. 02 AEP Model UK Model E Model SPECIFICATIONS • MDR-IF5000 is the component model block one in MDR-DS5000. Modulation System Frequency modulation Carrier wave frequency Right channel 2.8 MHz COMPONENT MODEL NAME FOR MDR-DS5000 Left channel 2.3 MHz Frequency response 12 –...
  • Page 17 SECTION 2 DISASSEMBLY • The equipment can be removed using the following procedure. Frame assy Hanger (L) Band Assy, Head Frame assy Hanger (R) RX board Band Assy, Head Note : Follow the disassembly procedure in the numerical order given. 2-1.
  • Page 18 2-4. RX BOARD 1 P 2.6X6 2 RX board 2-5. BAND ASSY, HEAD 3 stopper, PC board 5 band assy, head 2 RX SW board 1 wire When installing, take care to avoid extrusion of wire from the hanger. 4 claws –...
  • Page 19 1.2 V. 5. The processor section is used as jig to adjust the headphones section (MDR-IF5000). 6. Adjustment is made with the RX SW board and RX PD1 and RX PD2 boards (for both L-ch and R-ch) connected to the RX TP11 board with wires (normal part).
  • Page 20 MDR-IF5000 SECTION 4 DIAGRAMS 4-1. BLOCK DIAGRAM AUDIO (L) MIXER LIMITER IC31 SQUELCH TRIGGER WITH L34,35 HYSTERESIS TUNING QUAD COIL MUTE (+3.0V) (+1.7V) INFRARED OSCILLATOR SENSOR D1-4 MIXER LIMITER DRIVER AMP (L-CH) MIXER RF AMP BUFFER 2.3MHz BPF IC32 MIXER...
  • Page 21 MDR-IF5000 4-2. PRINTED WIRING BOARDS L-CH R-CH INFRARED SENSOR TP11 DRY BATTERY SIZE "AA" (IEC DESIGNATION R6) 2PCS, 3V NICKEL CADMIUM BATTERY (NC-AA) 700mAh 2.4V R-CH L-CH • Semiconductor Location Ref. No. Location C-13 F-13 C-10 F-10 IC31 IC32 IC51...
  • Page 22 MDR-IF5000 4-3. SCHEMATIC DIAGRAM • Refer to page 13 for IC Block Diagrams. Note: • All capacitors are in µF unless otherwise noted. pF: µµF • Total current is measured with POWER ON (no-sig- 50 WV or less are not indicated except for electrolytics nal) mode.
  • Page 23 SECTION 5 EXPLODED VIEW • IC Block Diagrams NOTE: • The mechanical parts with no reference • -XX and -X mean standardized parts, so number in the exploded views are not supplied. they may have some difference from the • Items marked “*” are not stocked since original one.
  • Page 24 SECTION 6 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in • Items marked “*” are not stocked since When indicating parts by reference the parts list may be different from the they are seldom required for routine service. number, please include the board.
  • Page 25 MDR-IF5000 RX PD1 RX PD2 RX SW Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 1-216-049-11 RES,CHIP 1/10W 1-671-720-11 RX SW BOARD 1-216-073-00 METAL CHIP 1/10W ************ 1-216-089-00 RES,CHIP 1/10W 1-216-063-00 RES,CHIP 3.9K 1/10W < SWITCH >...

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