HP Compaq dx2200 Disassembly Instructions Manual
HP Compaq dx2200 Disassembly Instructions Manual

HP Compaq dx2200 Disassembly Instructions Manual

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HP-00007-01, Appendix 3
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model
HP Compaq Business PC dx2200
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0
Items Requiring Selective Treatment
1.1
Items listed below are classified as requiring selective treatment.
1.2
Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
Batteries
Mercury containing components
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors/Condensers
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Components and waste containing
asbestos
Components, parts and materials
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances
Description
MT
Notes
With a surface > 10 square cm
All types including standard
alkaline and lithium coin or button
style batteries
For example, mercury in lamps,
display backlights, scanner
lamps, switches, batteries
Includes background illuminated
displays with gas discharge
lamps
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
HP Restricted
22-Mar-2006
Qty items in
product
3 (1 sys board,
2 P/S board)
1
0
0
0
0
0
0
0
0
0
0
0
0
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Summary of Contents for HP Compaq dx2200

  • Page 1 HP Compaq Business PC dx2200 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment. Items Requiring Selective Treatment Items listed below are classified as requiring selective treatment.
  • Page 2: System Board

    HP-00007-01, Appendix 3 22-Mar-2006 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable)
  • Page 3 HP-00007-01, Appendix 3 22-Mar-2006 POWER SUPPLY PRINTED CIRCUIT ASSEMBLY To remove the power supply (see Figure 4 below) a) Remove all cables connected to all devices in the chassis. b) Using a phillips screwdriver, remove the four screws that secure the power supply to the chassis.
  • Page 4 HP-00007-01, Appendix 3 22-Mar-2006 ILLUSTRATIONS Figure 1: Removing the front bezel Figure 2: Removing the heatsink Figure 3: Removing the system board Figure 4: Power supply screw locations HP Restricted Page 4...
  • Page 5 HP-00007-01, Appendix 3 22-Mar-2006 Figure 5: Cut the plastic cable clamp Figure 6: Power supply cover screw locations Figure 7: Cut the plastic cable clamp Figure 8: Power supply PCA screw locations Figure 9: Power supply PCA screw locations Figure 10: Cut all cables connected to the...
  • Page 6 HP-00007-01, Appendix 3 22-Mar-2006 FIGURE 11: Type 1 battery holder FIGURE 12: Type 2 battery holder FIGURE 13: Type 3 battery holder HP Restricted Page 6...