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Sony DR-BT50 Service Manual

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SERVICE MANUAL
Ver. 1.0 2007.02
General
Communication System
Bluetooth Specification version 2.0
Output
Bluetooth Specification Power Class 2
Maximum communication range
Line of sight approx. 10 m (30 ft)
*1
Frequency band
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
FHSS
Compatible Bluetooth Profiles
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HSP (Headset Profile)
HFP (Hands-free Profile)
Supported Codecs
*3
*4
SBC
, MP3
Transmission range (A2DP)
20 - 20,000 Hz (sampling frequency 44.1 kHz)
Supplied accessory
AC power adaptor (1)
Carrying porch (1)
Operating instruction (1)
*1
The actual range will vary depending on factors such as obstacles
between devices, magnetic fields around a microwave oven, static
electricity, reception sensitivity, aerial's performance, operating
system,
*2
Bluetooth standard profiles indicate the purpose of Bluetooth
communication between devices.
*3
Codec: Audio signal compression and conversion format
*4
Subband Codec
Sony Corporation
9-887-600-01
Personal Audio Division
2007B02-1
Published by Sony Techno Create Corporation
© 2007.02
SPECIFICATIONS
*2
DR-BT50
Canadian Model
Headset
Power source
DC 3.7 V: Built-in lithium-ion
rechargeable battery
Mass
Approx. 180 g (6.4 oz)
Rated power consumption
3.0 W
Receiver
Type
Closed type, dynamic
Driver unit
40 mm dome type
Reproduction frequency range
10 – 25,000 Hz
Microphone
Type
Omni directional, electret condenser
Effective frequency range
100 – 4,000 Hz
Design and specifications are subject to change without notice.
WIRELESS STEREO HEADSET
US Model
AEP Model
UK Model
E Model
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  • Page 1 Bluetooth standard profiles indicate the purpose of Bluetooth communication between devices. Codec: Audio signal compression and conversion format Subband Codec WIRELESS STEREO HEADSET Sony Corporation 9-887-600-01 Personal Audio Division 2007B02-1 Published by Sony Techno Create Corporation © 2007.02...

  • Page 2: Table Of Contents

    DR-BT50 TABLE OF CONTENTS 1. GENERAL ................3 Unleaded solder Boards requiring use of unleaded solder are printed with the lead 2. DISASSEMBLY free mark (LF) indicating the solder contains no lead. 2-1. Disassembly Flow ························································ 4 (Caution: Some printed circuit boards may not come printed with 2-2.

  • Page 3: General

    DR-BT50 SECTION 1 This section is extracted GENERAL from instruction manual. Location and Function of Parts POWER button VOL (volume) + button Multi function button Jog switch Controls various call functions. Controls various functions when listening to music. Indicator (blue) + /–...

  • Page 4: Disassembly

    DR-BT50 SECTION 2 DISASSEMBLY • This set can be disassembled in the order shown below. 2-1. DISASSEMBLY FLOW 2-2. HOUSING (R) ASSY 2-5. JACK BOARD (Page 4) (Page 6) 2-3. BATTERY HOLDER 2-6. SWITCH BOARD (Page 5) (Page 6) 2-4. MAIN BOARD 2-7.

  • Page 5: Battery Holder

    DR-BT50 2-3. BATTERY HOLDER 6 Remove the solder at 2 places. MAIN board 4 button panel 1 screw (B2.6) 3 claw 5 battery holder 2 screw (B2.6) 2-4. MAIN BOARD side A 3 Remove the solder at 2 places. 5 MAIN board...

  • Page 6: Jack Board

    DR-BT50 2-5. JACK BOARD 4 claw 5 JACK board 2 Remove the solder at 2 places. 3 claw Note : When exchange the FFC SWITCH board CN202 (Flexible Flat cable) conductor side 1 CNP202 Reinforce board 35mm MAIN board CN451 2-6.

  • Page 7: Diagrams

    DR-BT50 SECTION 3 DIAGRAMS NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. For schematic diagrams. For printed wiring boards. Note: Note: • All capacitors are in µF unless otherwise noted. (p: pF) • X : parts extracted from the component side.
  • Page 8 DR-BT50 IC261 BQ24010ADRCR I(BAT) O(REG) (ISET) CHG ENABLE (DETECT) (FAULT) I(BAT) ENABLE ENABLE VSET CHG ENABLE REFERENCE O(REG) AND BIAS THERMAL SHUTDOWN I(BAT) DEGLITCH (SLP) STAT1 CHARGE CONTROL, TIMER, STAT2 O(REG) DISPLAY LOGIC I(BAT) ENABLE RECHARGE (FAULT) DEGLITCH (RCH) ENABLE...

  • Page 9: Block Diagram

    DR-BT50 3-1. BLOCK DIAGRAM ANT101 ANTENNA SP302 PCM_OUT DACDAT LHPOUT RF_IN/OUT SPEAKER PCM_CLK BCLK (L-CH) PCM_SYNC 12 DACLRC REFI IC401 MIC301 IC420 47 A_IN_L_P/MIC_P AUDIO DAC (MIC) PIO_11 SDIN POWER AMP AIO_01 SCLK +1.5V SP301 48 A_IN_L_N/MIC_N AIO_03 XTI/MCLK RHPOUT...

  • Page 10: Printed Wiring Boards - Main Board

    DR-BT50 : Uses unleaded solder. 3-2. PRINTED WIRING BOARD – MAIN BOARD – MAIN BOARD ( SIDE A ) MAIN BOARD ( SIDE B ) MIC BOARD (RED) (Page 11) (BLK) • Semiconductor Location Ref. No. Location D102 D103 D201...

  • Page 11: Jack, Mic And Switch Board

    DR-BT50 3-3. PRINTED WIRING BOARD – JACK, MIC AND SWITCH BOARDS : Uses unleaded solder. – MIC BOARD SWITCH BOARD SWITCH BOARD ( SIDE A ) ( SIDE B ) MAIN BOARD (Page 10) 1-872-505- (11) JACK BOARD ( SIDE A )

  • Page 12: Schematic Diagram

    DR-BT50 • See page 7, 8 for IC Block Diagrams. • See page 13 for IC Pin Function Description. 3-4. SCHEMATIC DIAGRAM > DR-BT50...

  • Page 13: Ic Pinfunction Description

    DR-BT50 3-5. IC PIN FUNCTION DESCRIPTION IC401 WM8711LGEFL/R (AUDIO DAC) (MAIN BOARD) Pin No. Pin Name Description XTI/MCLK Master clock input Not used (Open) DCVDD Power supply (+2V) DGND Ground DBVDD Power supply (+2V) CLKOUT Not used (Open) BCLK Digital audio bit clock signal output...

  • Page 14: Exploded Views

    DR-BT50 SECTION 4 EXPLODED VIEWS NOTE: • The mechanical parts with no reference number • -XX, -X mean standardized parts, so they may in the exploded views are not supplied. have some differences from the original one. • Items marked “*” are not stocked since they •...

  • Page 15: Housing (R) Section

    DR-BT50 4-2. HOUSING (R) SECTION MIC301 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 2-688-747-01 PAD, EAR 2-898-933-01 CUSHION, MIC 3-253-143-01 SCREW (B2.6), (+) P TAPPING X-2177-242-1 PLATE (R), FRONT SUB ASSY 3-254-082-11 SCREW 1-542-593-12 DRIVER (040F020)

  • Page 16: Electrical Parts List

    DR-BT50 SECTION 5 JACK MAIN ELECTRICAL PARTS LIST NOTE: The components identified by • RESISTORS • Due to standardization, replacements in the mark 0 or dotted line with mark All resistors are in ohms. parts list may be different from the parts 0 are critical for safety.
  • Page 17 DR-BT50 MAIN Ref. No. Part No. Description Remarks C414 1-164-943-81 CERAMIC CHIP 0.01uF IC451 (Not supplied) IC uPD78F0500FC (S) -AA3-A C415 1-135-259-11 TANTAL. CHIP 10uF 6.3V C417 1-125-777-11 CERAMIC CHIP 0.1uF < JUMPER RESISTOR > C418 1-125-777-11 CERAMIC CHIP 0.1uF...
  • Page 18 DR-BT50 MAIN SWITCH Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R136 1-218-953-11 RES-CHIP 1/16W R137 1-218-953-11 RES-CHIP 1/16W A-1231-897-A MIC BOARD, COMPLETE R139 1-218-953-11 RES-CHIP 1/16W ******************** R151 1-218-965-11 RES-CHIP 1/16W < CAPACITOR > R152...
  • Page 19 DR-BT50 MEMO...
  • Page 20 DR-BT50 REVISION HISTORY Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ver. Date Description of Revision...

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