Page 1
MDS-JA555ES SERVICE MANUAL US Model Canadian Model AEP Model UK Model Photo : GOLD U.S. and foreign patents licensed from Dolby Laboratories Model Name Using Similar Mechanism MDS-JA20ES Licensing Corporation. MD Mechanism Type MDM-6A Base Unit Type MBU-5C Optical Pick-up Type...
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE VAROITUS REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU Parist voi räjähtää, jos se on virheellisesti asennettu.
TABLE OF CONTENTS Laser component in this product is capable of emitting radiation exceeding the limit for 1. SERVICING NOTE ·························································· 6 Class 1. 2. GENERAL ········································································ 12 3. DISASSEMBLY 3-1. Case ·················································································· 14 3-2. Loading Panel ··································································· 14 3-3. Front Panel Assembly ······················································· 15 3-4.
Page 4
1. While pressing the lAMSL knob and the x button at the same time, connect the AC power plug to the wall outlet, then remove your hands from the lAMSL knob and x button at the same time. When the MDS-JA555ES enters the test mode, the message “[Check]”...
Page 5
[Displaying Contents of the Error History] Display on screen Contents of error history total rec Displays the recording time. The display appears in “r h”. This is the accumulated time when the laser is in the “high power” operation. This is about 1/4 of the actual recording time. The time is shown in the range of 0h to 65535h in hexadecimal number.
Forced Reset Use this function when the MDS-JA555ES cannot be operated normally due to hung-up of the microprocessor. It is recommended to use this function when you cannot exit the test mode or the retry-cause-display mode, or when the normal operation cannot be performed after the MDS-JA555ES is disassembled once then re-assembled.
Page 7
[BD Board Waveform Check Tool] Use of the exclusive tool (J-2501-149-A) is convenient to check the waveforms on the BD board. GND : Ground terminal I+3V : For measuring IOP (Checking deterioration of the optical pickup laser) : For measuring IOP (Checking deterioration of the optical pickup laser) TEO : TRK error signal (traverse adjustment) : Reference level for when checking signals : RF signal (jitter check)
Page 8
(BD Board IC171)] The IOP data that is indicated on the optical pick-up, can be saved in the non-volatile memory of the MDS-JA555ES. Saving the IOP data in the memory eliminates the needs to look at the printed value on the label that is attached on the surface of optical pick-up, and enables to view the IOP data on display.
Page 9
Note: The judgment criterion is shown for the purpose of judging if the performance is acceptable or not. This is not the specification value for adjustment. Use the specification value for adjustment when the MDS-JA555ES is going to be adjusted.
Page 10
8. When you want to enter the “Track mode”, press the N button to start playback. 9. To exit the test mode, press the ?/1 button. The message “TOC” flashes, the MDS-JA555ES enters the standby mode and exits the test mode.
Page 11
Reading the Display: Convert the hexadecimal display of each digit into binary display. If more than two causes, they will be added. Example When 42 is displayed: Higher bit: 4 = 0100 → b6 Lower bit: 2 = 0010 → b2 In this case, the retry cause is combined of “CLV unlock”...
SECTION 3 DISASSEMBLY Follow the disassembly procedure in the numerical order given. Note : 3-1. CASE 3 Remove the upper case 1 Two screws in the direction of the arrow A (CASE 3 TP2) 1 Screw (CASE 3 TP2) 1 Two screws (CASE 3 TP2) 2 Open the top cover 3-2.
3-5. TRAY ASSEMBLY 4 Bracket (top) 2 Two screws 2 Two screws (BV2.6) (BV2.6) 6 Screw (BV2.6) 7 Stopper (shaft B) 5 Three gears 3 Lug (top) 8 Shaft 5 Three gears (top) 9 Remove the tray asssembly in the direction of the arrow B . 1 Rotate the pully gear in the direction of the arrow A and pull the tray assembly.
3-6. BU HOLDER ASSEMBLY 2 Two scews (BV2.6) 3 Two collars 2 Two scews (damper) (BV2.6) 3 Two collars (damper) 4 Two compression 4 Two compression springs springs 5 BU holder assembly Fig. A Slider 1 Turn the pully gear to align the slider with of the rib.
3-8. BASE UNIT (MBU-5C) 1 Leaf spring (UDL) 2 Leaf spring (UDR) 3 Remove the holder assembly in the direction of the arrow A . 5 Base unit 4 Two screws 4 Two screws (BV2.6) (BV2.6) 3-9. BD BOARD 5 Two precision screws (+P1.7 ×...
Page 19
3-10. OVER LIGHT HEAD (HR901) 2 Screw 3 Over light head (P1.7 × 6) (HR901) 1 Flexible board (CN104) 3-11. MINI DISC DEVICE (KMS-260B/J1N) 2 Screw +B 3 Leaf spring (shaft) (B2 × 8) 4 Main shaft 5 Remove the mini disc device (KMS-260B/J1N) in the direction of the arrow A .
4-1. Precaution on Using the Test Mode • Be sure to insert and eject a disc after confirming that the disc in the MDS-JA555ES has come to complete stop because the loading related movements of the mechanism are performed without any relationship with the test mode.
Page 21
4-5. Selecting the Test Mode There are 31 types of the test mode. The group can be switched by rotating the lAMSL knob. Select the group to be used and press the YES button. After each group is entered, each mode can be switched by rotating the lAMSL . For the selected contents, refer to the “Group”...
Page 22
4-5-1. Operating the Continuos Playback Mode 1. Entering the continues playback mode 1) Load the disc into the unit. (recordable disc or disc for playback) The disc is loaded by pushing the tray. 2) Rotate the lAMSL knob to display “CPLAY MODE” (C30). 3) Press the YES button to change the display to “CPLAY MID”.
Page 23
4-5-2. Operating the Continuos Recording Mode (Use this mode for self record/playback check only) 1. Entering the continuos recording mode 1) Load the recordable disc to the unit. The disc is loaded by pushing the tray. 2) Rotate the lAMSL knob to display “CREC MODE” (C31). 3) Press the YES button to change the display to “CREC MID”.
Page 24
4-7. Test Mode Displays Each time the DISPLAY/CHAR button is pressed, the display changes in the following order. 1. MODE display Displays “TEMP CHECK”, “CPLAY MODE”, etc. MODE display 2. Error rate display ↓ Error rates are displayed as follows. Error rate display AD = ↓...
SECTION 5 ELECTRICAL ADJUSTMENTS 5-1. On Part Replacement and Adjustment • Perform the checks and adjustments of the MDM and MBU blocks following the procedure below . The procedure is changed depending on the replaced part. • Abbreviation : Optical pick-up OWH : Overwrite head •...
Page 26
5-2. Precautions for Checking Laser Diode 2) Set the test mode when performing the adjustments. After completing the adjustments, exit the test mode. Emission Perform the adjustments and checks in “Group S” of the test To check the emission of the laser diode during adjustments, never mode.
Page 27
5-5. Creating Continuos Recorded Disc 5-6-2. Laser Power Check Before check: • This disc is used in focus bias adjustment and error rate check. • Refer to Section 1 “Service note” How to open the disc tray when The following describes how to create a continuos recording disc. power switch is turned off, and laser power check.
Page 28
5-6-3. Traverse Check 8. Observe the waveform of the oscilloscope and confirm it that is within the specified value. Do not rotate the lAMSL Note 1 : If the recorded disc is used for this adjustment, the knob at this time. data is deleted.
Page 29
• The error rate is checked using the self record/playback disc. Manufacture the self record/playback disc by user locally using Checking procedure: the MDS-JA555ES that is going to be measured of its error rate 1. Load the test disc (MDW-74/AU-1). by means of continuous recording.
Page 30
Adjustment The IOP data that is indicated on the pickup, can be saved in the non-volatile memory of the MDS-JA555ES. The IOP data that is The temperature data at 25°C is used as the reference data and is printed on the optical pickup and the IOP data after adjustment is saved in the non-volatile memory for offset adjustment.
Page 31
2. Rotate the lAMSL knob to display “LDPWR CHECK” 5-11. Traverse Adjustment (C10). (laser power: for adjustment) Note1: If the recorded disc is used for this adjustment, the data 3. Press the YES button once to display “LD 0.9mW $ ”.
Page 32
8. Rotate the lAMSL knob so that the waveform of the 18. Press the YES button to save the adjustment results in the non- oscilloscope is the specified value. (The figure of the “ EFB volatile memory. (At this time “EFB = SAV”...
Page 33
5-13. Error Rate Check 9. Press the MENU/NO button and press the A button to eject 5-16. Adjusting Points and Connecting Points the test disc. 5-13-1. CD Error Rate Check Checking procedure: [BD BOARD] (SIDE A) Note 1 : If the C1 error and ADER are out of the specified value at 1.
MDS-JA555ES MAIN SECTION DIGITAL INPUT SELECTOR IC405 OPTICAL OPT1 RECEIVER DIGITAL IN IC401 DIGITAL IN (Page 34) DIGITAL FILTER A/D CONVERTER RV760 PJ501 (1/2) IC301 IC302 WAVE OPTICAL REC LEVEL LINE (ANALOG) SHAPER OPT2 RECEIVER ANALOG IC404 DIGITAL IN IC402...
MDS-JA555ES 6-2. CIRCUIT BOARD LOCATION THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. AC board (In addition to this, the necessary note is printed in each block.) BD board Note on Schematic Diagram: Note on Printed Wiring Boards: DIGITAL board •...
MDS-JA555ES 6-3. PRINTED WIRING BOARD BD SECTION • Refer to page 37 for Note on Printed Wiring Boards. • Refer to page 37 for Circuit Board Location. FOR ADJUSTMENT • Semiconductor • Semiconductor Location Location Ref. No. Location Ref. No. Location...
Page 39
MDS-JA555ES 6-4. SCHEMATIC DIAGRAM BD SECTION(1/2) • Refer to page 37 for Note on Schematic Diagrams. • Refer to page 56 for Waveforms. • Refer to page 58 for IC Block Diagram. • Refer to page 63 for IC Pin Function.
Page 40
MDS-JA555ES 6-5. SCHEMATIC DIAGRAM BD SECTION(2/2) • Refer to page 37 for Note on Schematic Diagrams. • Refer to page 56 for Waveforms. • Refer to page 57 for IC Block Diagram. • Refer to page 62 for IC Pin Function.
MDS-JA555ES 6-8. PRINTED WIRING BOARD AD SECTION • Refer to page 37 for Note on Printed Wiring Boards. • Refer to page 37 for Circuit Board Location. (Page 53) (Page 49) (Page 54) • Semiconductor Location Ref. No. Location D301...
Page 43
MDS-JA555ES 6-9. SCHEMATIC DIAGRAM AD SECTION(1/2) • Refer to page 37 for Note on Schematic Diagrams. • Refer to page 56 for Waveforms. • Refer to page 68 for IC Pin Function. US,CND MODEL MODEL US,CND MODEL MODEL...
Page 44
MDS-JA555ES 6-10. SCHEMATIC DIAGRAM AD SECTION(2/2) • Refer to page 37 for Note on Schematic Diagrams. • Refer to page 56 for Waveforms. • Refer to page 59 for IC Block Diagrams. • Refer to page 66 for IC Pin Function.
Page 45
MDS-JA555ES 6-11. SCHEMATIC DIAGRAM DA SECTION(1/2) • Refer to page 37 for Note on Schematic Diagrams. • Refer to page 56 for Waveforms. • Refer to page 59 for IC Block Diagrams.
MDS-JA555ES 6-12. PRINTED WIRING BOARD DA SECTION • Refer to page 37 for Note on Printed Wiring Boards. • Refer to page 37 for Circuit Board Location. • Semiconductor Location (Page 42) Ref. No. Location D501 F-10 D502 D503 J-10...
Page 47
MDS-JA555ES 6-13. SCHEMATIC DIAGRAM DA SECTION(2/2) • Refer to page 37 for Note on Schematic Diagrams. • Refer to page 56 for Waveforms. •Refer to page 60 for IC Block Diagrams.
MDS-JA555ES 6-14. PRINTED WIRING BOARD DIGITAL SECTION • Refer to page 37 for Note on Printed Wiring Boards. •Refer to page 37 for Circuit Board Location.
MDS-JA555ES 6-15. SCHEMATIC DIAGRAM DIGITAL SECTION • Refer to page 37 for Note on Schematic Diagrams. • Refer to page 61 for IC Block Diagrams. The components identified by Les composants identifiés par mark ! or dotted line with mark une marque ! sont critiques ! are critical for safety.
MDS-JA555ES 6-17. SCHEMATIC DIAGRAM POWER SECTION • Refer to page 61 for Circuit Board Location. • Refer to page 37 for Note on Schematic Diagrams. The components identified by Les composants identifiés par mark ! or dotted line with mark une marque ! sont critiques ! are critical for safety.
6-22. IC PIN FUNCTION DESCRIPTION • BD BOARD IC101 CXA2523AR (RF AMPLIFIER, FOCUS/TRACKING ERROR AMPLIFIER) Pin No. Pin Name Description RF signal input (I) that is supplied form the optical pickup detector and has already been I-V converted RF signal input (J) that is supplied form the optical pickup detector and has already been I-V converted Middle point voltage (+1.65 V) generation output 4 to 9 A to F...
Page 63
• BD BOARD IC121 CXD2656R (DIGITAL SIGNAL PROCESSOR, DIGITAL SERVO SIGNAL PROCESSOR, EFM/ACIR ENCODER/DECODER, SHOCK-PROOF REMOTE CONTROLLER, ATRAC ENCODER/DECODER) Pin No. Pin Name Description Focus OK signal output to system controller (IC800) MNT0 (FOK) Outputs “H” when focus is set (“L”: NG) MNT1 (SHOCK) Track jump detection signal output to system controller (IC800) MNT2 (XBUSY)
Page 64
Pin No. Pin Name Description Address signal output to external D-RAM Not used (Blank terminal) DVSS — Ground (Digital) Output enable signal output to D-RAM (IC124) “L”: Active XCAS Column address strobe signal output to D-RAM (IC124) “L”: Active Address signal output to D-RAM (IC124) XRAS Low address strobe signal output to D-RAM (IC124) “L”: Active Write enable signal output to D-RAM (IC124) “L”: Active...
Page 65
Pin No. Pin Name Description TFDR Tracking servo drive PWM signal output to BH6511FS (IC152) DVDD — Power supply (+3.3 V) (Digital) FFDR Focus servo drive PWM signal output to BH6511FS (IC152) (+) FRDR Focus servo drive PWM signal output to BH6511FS (IC152) (-) 176.4 kHz clock signal output (X’tal system) Not used in this system (Blank terminal) SRDR Sled servo drive PWM signal output to BH6511FS (IC152) (-)
Page 66
• AD BOARD IC301 CXD8512Q (DIGITAL FILTER) Pin No. Pin Name Description TEST Input pin for test (Fixed at “L”) — Not used in this system (Blank terminal) SYNC Sync mode selector input. “L”: Slave mode. “H”: Master mode. Fixed to “L” INIT Reset signal input from the system controller (IC800) “L”: Reset —...
Page 67
Pin No. Pin Name Description — Not used in this system (Blank terminal) Input terminal to set the low-cut function. “L: OFF, “H”: ON. (Fixed at “H”) Input terminal to set the noise shaving function. “L: OFF, “H”: ON. (Fixed at “H”) —...
Page 68
• AD BOARD IC800 M30624MG-215FP (SYSTEM CONTROLLER) Pin No. Pin Name Description JOG1 Jog dial pulse input from rotary encoder (S713 lAMSL) (phase B input) Jog dial pulse input from rotary encoder (S713 lAMSL) (phase A input) JOG0 C1ERO C1 error rate output during test mode (Blank terminal) ADERO ADER output during test mode (Blank terminal) SQSY...
Page 69
Pin No. Pin Name Description MNT1 (SHOCK) Track jump detection signal input from CXD2656R (IC121) SENS Internal status (SENSE) input from CXD2656R (IC121) Laser diode ON/OFF control signal output to automatic power control circuit LDON “H”: Laser ON Disc reflection rate detection input from the reflect detection switch (S102). “L”: High reflection disc. REFLECT “H”: Low reflection disc PROTECT...
Page 70
Pin No. Pin Name Description A1OUT SIRCS remote control signal input for the S-LINK control A1 Audio line muting control signal output MUTE “L”: Line muting ON Strobe control signal output to power supply circuit “L”: Standby mode, “H”: Power ON Selection signal output of optical 1/2 input or coaxial input to digital input signal selector (IC405) COAX/XOPT L: Digital optical 1/2 input, “H”: Coaxial input...
SECTION 7 EXPLODED VIEWS NOTE: • -XX, -X mean standardized parts, so they may • The mechanical parts with no reference number The components identified by mark ! or have some differences from the original one. in the exploded views are not supplied. dotted line with mark ! are critical for safety.
T002 7-3. CHASSIS ASSEMBLY T001 supplied UK model not supplied MDM-6A not supplied not supplied AEP model not supplied US, Canadian model supplied supplied supplied supplied not supplied not supplied not supplied Ref. No. Part No. Description Remarks Ref. No. Part No.
SECTION 8 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the • CAPACITORS: • SEMICONDUCTORS parts list may be different from the parts uF: µF In each case, u: µ, for example: specified in the diagrams or the components •...